• RE: ADuCM355 Using AFE Clock for Digital Die

    Hi Yan-Wei,

    A couple of points to note:

    - The digital die maximum clock rate is 26MHz. This is the max clock rate the memories and digital logic were tested and qualified to. 

    - Did you follow the steps in the user guide under the section "Connecting AFE…

  • RE: HMC6981LS6 Die dimensions

    Hi Alessandro,

                            The information you are requesting is considered proprietary to Analog Devices and  can't be provided. Thermal analysis of the HMC6981LS6 has been done and we provide theta JC, the thermal resistance from the channel to the ground paddle…

  • RE: LTC2000 Operating Temperature vs Junction temperature

    The 70C is referring to the temperature of the die. Keep the die lower than 70C with a heatsink or use a higher temperature grade. 

  • HMC341 die

    Where can I get the S parameter of LNA HMC341 measured on die? The S papameter offered on website is the results measured on test board.

  • HMC392A-Die

    I wanted to Simulate the HMC392A in Microwave office. So i downloaded its S2P file from design resources and as i performed simulation its responses like return loss is better than the datasheet but its gain is decreased to max15.7 dB after simulation…

  • ltc2641 die -

    The largest temp range the DAC will operate per the data sheet is -40 to +85 C. If I get the die will it operate at -55 to 125C? I will be mounting the die on ceramic substrate.

    does the assumption that it will work if properly heatsunk although the…

  • HMC939A-DIE

    Please provide S-parameters for HMC939A-DIE. Thanks.

  • Die Temperature

    How can I determine the die temperature of your device?

  • HMC598 Die

    Hello,

    Do you have a maximum power consumption for the HMC598 in die form? The data sheet shows 175 mA @ 5 volts, but it's only a typical number and I'm seeing  220 mA @ 5volts, with no input signal or output load. Thanks.

    Best Regards.

  • RE: RH1814 Thermal Resistance

    I need to predict the junction temperature of the die (bare die soldered onto a board). Do you have any test data or thermal resistance data that would be relevant? If you have a theta JC for a packaged version of this die, I would also be interested…